Hi EE Majors,
Excellent opportunity to work on cutting-edge technology that has the potential to revolutionize the way Artificial Intelligence and neural networks are computed.
If you are interested in this opportunity contact John Crimmins at john.crimmins@live.com
PlasmaChip
is currently building a prototype in Gainesville that has the potential
to revolutionize the way Artificial Intelligence and neural networks
are computed, and we are looking for paid help.
We
are seeking two eager candidates looking to work on cutting-edge
technology. We are filling two positions in February in order to speed
up work on our
prototype. The prototype is a flexible, 3D hardware neural network
derived from electrospun fibers and CMOS neurons that learns like the
human brain. This neuromorphic hardware design is a neural network that
mimics biological brains by implementing sparse
memristive connections, but bypasses the scaling limitations imposed by
current architectures.
If successful, this AI computing hardware will use less chip space and cost far less at scale.
We are looking for:
·
A Materials Science Engineer with interest or experience in electronic materials, ionic materials, and/or
memory devices.
·
An Electrical Engineer with interest or experience in analog design, lithography, and/or neuromorphic
hardware. You would be building an entirely new computer interface for our analog hardware.
These positions will be paid according to education and experience level:
Undergraduates: $18-22/hr,
Graduates: $28-32/hr.
There is also a potential for long-term employment and equity considerations in the future.
Please inquire with a brief bio, CV, or resume by email at
John.Crimmins@live.com or via call/text at 352-474-9661. Successful referrals of qualified candidates are much appreciated as well.
Thank you,
John Crimmins
Director of US Operations
PlasmaChip
M: 352-474-9661
Meilleure usine d'adhésif et de colle conductrice et conductrice en Chine, colle étanche pour plastique, métal, verre et caoutchouc, spécialisée dans les adhésifs pour semi-conducteurs, appareils ménagers et applications de montage électronique et matériaux de protection de surface pour emballages et tests de copeaux. Adhésif à durcissement UV pour métal
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